Şirket Blog About TE 2291931-1 Integrated 400Gb/s High Speed Pluggable I/O Connectors

Shenzhen Mingjiada Electronics Co., Ltd. supplies the TE 2291931-1 integrated 400Gb/s high-speed pluggable I/O connector.

Against the backdrop of rapid technological advancements in cloud computing, supercomputing centres, 5G/6G communications and high-end network equipment, demand for data transmission bandwidth is growing exponentially, and 400G high-speed interconnects have become standard in mid- to high-end data centres and core network equipment. The TE 2291931-1 integrated 400Gb/s high-speed pluggable I/O connector is a monolithic cage-integrated connector assembly built to the CDFP Style 1 standard. Designed specifically for high-bandwidth, high-density and high-reliability high-speed signal transmission scenarios, it reliably delivers ultra-fast 400Gb/s data transmission per port, making it a core interconnect component for next-generation high-speed network hardware.

I. Core Overview of the 2291931-1 Product

The TE 2291931-1 belongs to the HSIO (High-Speed Interconnect I/O) product series. Its core configuration is a monolithic cage assembly with an integrated connector, which eliminates the traditional split design where the connector and cage are separate. This achieves structural integration and simplified installation, significantly streamlining equipment PCB layout and assembly processes. Strictly adhering to the CDFP industry standard, this product features a 0.75 mm precision centre-to-centre pitch design, supports sealed protection and efficient EMI shielding, and is specifically tailored for high-speed signal transmission scenarios. Suitable for demanding industrial-grade operating conditions, it represents a 400G interconnect solution that balances high performance, high integration and high stability.

The product supports a maximum data transfer rate of 400 Gb/s per port. Based on a 16-channel bidirectional data transmission architecture, the transmission rate per channel can reach 28 Gb/s, perfectly meeting the bandwidth upgrade requirements of high-speed data centre switches, routers, servers and high-end storage devices. It is also compatible with the next-generation PCIe Gen6 high-speed transmission protocol, demonstrating exceptional technological foresight.

II. Key Technical Parameters and Hardware Specifications

Thanks to its precision hardware design and stringent manufacturing standards, the TE 2291931-1 establishes a solid performance foundation for 400G high-speed transmission. The core parameters, which comprehensively cover the four key dimensions of electrical, structural, environmental and manufacturing specifications, are as follows:

1. Electrical Performance Parameters

- Maximum data rate: 400 Gb/s per port; supports 16-channel bidirectional parallel transmission; 28 Gb/s per channel, flexibly adapting to high-speed differential signal transmission requirements

- Circuit type: Pure signal transmission circuit, optimised specifically for high-speed data signals; free from power supply interference losses, ensuring signal integrity

2. Structural and Manufacturing Specifications

- Standard Type: CDFP Style 1 standard specification; single-cage, single-port 1×1 matrix layout

- Precision Pitch: 0.75 mm centre-to-centre pitch; high-density pin layout with a 60-contact design, balancing transmission density and signal isolation

- Mounting Method: Single-sided PCB mounting; through-hole solderless connection process; facilitates easy assembly and secure connections, effectively reducing the risk of soldering faults

- Product Dimensions: Length 54.3 mm; compact design significantly saves PCB space on equipment, suitable for 1U high-density rack-mounted equipment

3. Materials and Protection Characteristics

- Core Materials: The cage is made of high-strength zinc alloy with a nickel-plated finish, offering corrosion resistance and resistance to deformation; terminals are made of phosphor bronze, providing excellent electrical conductivity and a long mating cycle life

- Sealing Performance: Features a sealed design that effectively prevents dust and moisture from entering the equipment, making it suitable for complex industrial and data centre environments

- EMI Shielding: Equipped with a shielding structure incorporating elastic sealing rings, which efficiently suppresses electromagnetic interference and signal crosstalk, ensuring stable high-speed data transmission

4. Environmental Adaptation Parameters

- Operating temperature range: -40°C to 85°C. This ultra-wide temperature range accommodates diverse operating conditions, including indoor data centres, outdoor telecommunications base stations and industrial computing equipment, with no performance degradation in high or low-temperature environments

III. Core Design Advantages of the 2291931-1 Product

1. Integrated Design, Simplifying Hardware Architecture

Unlike traditional split-structure designs where the connector and cage are separate, the TE 2291931-1 integrates the connector and cage into a single unit, eliminating the need for additional cage components and enabling one-step PCB mounting and securing. This design not only reduces the number of components, lowering equipment assembly costs and failure rates, but also greatly simplifies PCB routing, shortens signal transmission paths, and minimises signal loss and latency at the hardware level, aligning with the trend towards miniaturisation and integration in high-density, high-speed equipment.

2. Ultra-high-speed transmission, compatible with next-generation protocols

Leveraging a 16-channel bidirectional parallel transmission architecture, the product achieves ultra-high bandwidth transmission of 400 Gb/s per port—double the bandwidth of 200G connectors—and can meet the demand for instantaneous throughput of massive amounts of data. At the same time, the product is compatible with next-generation high-speed transmission protocols such as PCIe Gen6, supporting technological upgrades for computing and high-speed networking equipment. It possesses the capacity to adapt to long-term technological iterations, thereby preventing rapid hardware obsolescence.

3. High reliability and interference resistance, with robust transmission stability

To address issues commonly encountered in high-speed signal transmission—such as crosstalk, electromagnetic interference and signal attenuation—the product optimises channel isolation through a precision 0.75mm pitch layout. Combined with an EMI shielding structure featuring elastic sealing rings, this effectively isolates external electromagnetic interference and internal channel crosstalk. Furthermore, high-quality phosphor bronze terminals ensure stable electrical conductivity, whilst a zinc alloy reinforced cage enhances structural strength, providing resistance to repeated plugging and unplugging, vibration and deformation, and ensuring long-term operation without signal packet loss or bit errors.

4. Adaptability to a wide range of operating conditions and exceptional versatility

Featuring a sealed protective design and an ultra-wide operating temperature range of –40°C to 85°C, the product can operate stably in complex environments such as temperature-controlled data centres, high-temperature industrial computing scenarios and low-temperature outdoor telecommunications environments. The standardised CDFP interface design ensures product compatibility, enabling it to be adapted to various mainstream 400G optical modules and copper cable assemblies, whilst being compatible with mainstream switch, server and storage hardware platforms on the market, demonstrating outstanding versatility and adaptability.

IV. Key Application Scenarios for the 2291931-1

Leveraging its core strengths of ultra-high 400Gb/s bandwidth, high integration and high reliability, the TE 2291931-1 is widely used in high-end, high-speed interconnect scenarios and serves as a core interconnect component for next-generation computing networks:

- Hyperscale data centres: Used in 400G core switches, TOR access switches and server uplink ports to support high-speed exchange of massive data volumes for cloud computing, big data and AI computing clusters, thereby enhancing the overall throughput efficiency of data centres

- High-end computing equipment: Suitable for supercomputing servers, AI training servers and distributed storage devices, meeting the requirements for ultra-low-latency, ultra-high-bandwidth data transmission between high-density computing nodes

- 5G/6G core telecommunications equipment: Deployed in core network routers and base station aggregation equipment, supporting 5G high-definition backhaul and 6G pre-research high-speed data transmission, and adapting to bandwidth upgrades and iterations in telecommunications networks

- Industrial high-speed interconnection equipment: Used in industrial computing gateways, high-end industrial switches and intelligent measurement and control equipment, meeting the requirements for high-speed data acquisition and transmission under complex industrial operating conditions

V. Application Value of Product 2291931-1

The TE 2291931-1 integrated 400Gb/s high-speed pluggable I/O connector precisely meets the current development requirements of high-speed networks: ‘high bandwidth, high density, high reliability and miniaturisation’. Its integrated design reduces equipment R&D, assembly and O&M costs; the ultra-high 400G bandwidth eliminates the bandwidth bottlenecks of traditional interfaces; stable high-speed transmission performance ensures the efficient operation of computing and communications networks; and stringent industrial-grade quality enhances the equipment’s overall service life and environmental adaptability.

As TE Connectivity’s next-generation CDFP-standard high-speed interconnect product, this device provides a mature and reliable hardware solution for the 400G upgrade of data centres, computing centres and telecommunications networks, whilst laying the hardware foundation for future iterations of 800G and 1.6T ultra-high-speed networks, offering exceptional value for engineering applications and industry-wide adoption.